Electronic Assembly
Semiconductor Package
Hermetic Package
Industry & Engineering
Thermal Conductive Materials
Thermal conductive adhesive
We provide epoxy resin, silicone and special resin thermal conductive adhesives with constant temperature / low temperature curing, high strength, high thermal conductivity, suitable for heat dissipation applications such as heat sinks, flip chips, transformers, high power LEDs, etc., suitable for bonding various materials.
Thermal grease
We provide epoxy and silicone thermal greases with high thermal conductivity, high temperature tolerance, high reliability and easy operation. They are suitable for various processes and can be used in applications that require heat dissipation, such as heat sinks, flip chips, transformers, high power LEDs, etc.
Thermal Gap Fillers
Thermally conductive gap fillers are materials used to fill the gap between heat-generating electronic components and heat dissipation devices (such as heat sinks or chassis) to improve thermal conductivity and thermal management. They are commonly used in electronic applications where heat dissipation is critical, such as LED lighting, automotive electronics, and computer systems.
Features
High Bond Strength: AI Technology Group’s die attach epoxy adhesives offer high bond strength to a variety of substrates including gold, silver, copper, aluminum and stainless steel, making them ideal for semiconductor packaging and electronics manufacturing.
Excellent Thermal Conductivity: This epoxy adhesive has excellent thermal conductivity and low thermal resistance, allowing it to dissipate heat better than other adhesives. This property is critical in electronic devices that require efficient heat dissipation.
Electrical Insulation: Die attach epoxy adhesive provides electrical insulation, helping to prevent shorts between the die and the lead frame. It also provides protection against electrostatic discharge (ESD).
Fast Curing: The adhesive cures quickly at room temperature, significantly shortening manufacturing time and increasing production output.
Low Outgassing: AI Technology Group’s die attach epoxy adhesives have low outgassing, reducing the risk of contamination in vacuum systems and space applications.
RoHS Compliant: This adhesive is RoHS compliant, which means it meets EU requirements for hazardous substances in electronic products.
Features
AUD1: Ordinary PVC Cutting Tape AUD1 is a general-purpose wafer cutting tape that prevents leakage, chip flying, and gaps, and is easy to remove after UV exposure.
AUD5: CIS (CMOS Image Sensor) Cutting PVC Tape This tape is widely used in Korea because it has a good yield for CIS chips. Prevents leakage, chip flying out, gaps, and is easy to remove after UV exposure.
AUD7: Small chip cutting PVC tape Blue PVC cutting tape, suitable for small chip cutting, laser marking through the tape has a good effect.
AUF3: PCB and wafer cutting PO tape This tape has strong adhesion, suitable for PCB cutting, using PO film environmental protection.
AU105-HA: PO tape for wafer cutting and glass filter protection PO tape is suitable for wafer cutting and has good effect when packaging glass for a long time. There is no residue and stain after UV treatment.
AUP165-HC: Small chip dicing tape and excellent label readability The high transmittance of the tape makes barcodes easier to read and can cut small packaged chips up to 0.6 * 0.3mm in size.
AUP170-HC: Common packaging dicing tape This is a high-adhesion common packaging dicing tape. After UV irradiation, the chip can be easily removed from the tape without residue.
AUP1: Power QFN Cutting Tape AUP1 can stably fix when cutting thick packages such as PQFN and ceramics. After UV irradiation, the chip can be easily removed without residue.
AUP4: Small Package Wafer Dicing Tape and Low Odor Type This product is suitable for packaged products of 3*3mm or smaller, and provides a more comfortable working environment with low odor after UV irradiation.
AUG2: Glass and LED cutting PO tape This tape uses PET film and has strong adhesion. It is suitable for materials that need to firmly hold the chip during the cutting process, such as glass or LED.
AMC's dicing tape is a high-performance solution for wafer dicing applications, offering high strength, strong adhesion, low residual stress, consistent performance and a variety of sizes. It is an important component in the wafer dicing process, helping to ensure high yield and high-quality diced wafers.
LORD® JMC-700K Protective Coating
Technical data sheet
LORD® JMC-700K coating is a heat-cured epoxy designed for thin film coatings on heat sinks and magnets. The coating provides electrical insulation, heat and oil resistance, and can be applied in a single coat. It can be used in a wide range of automotive applications, including cold plates, heat sinks, and motor magnets for electric vehicles, as well as automotive parts and industrial machinery applications.
Features and advantages:
Good Adhesion – Provides strong adhesion to substrates.
Wide Temperature Range – Can be used in components and devices operating in temperatures ranging from -40°C to +180°C.
Environmental Resistance – Excellent resistance to heat, oil and moisture.
Heat resistance test
180°C x 1500 hours
Cycle test
-40°C to +170°C, 1500 cycles
Oil resistance test
150°C x 2000 hours
Humidity resistance test
85°C, 85% RH x 2000 hours
Application:
Surface Preparation – Before coating application, clean the surface thoroughly to remove all dirt, grease and oxidation.
Mixing – Stir coating thoroughly before use. If thinning is necessary, use LORD JMC-700ST Thinner or ethyl acetate (MEK) as the thinner.
Application – Can be applied by dipping or spraying. Regardless of the application method, the recommended dry film thickness for LORD JMC-700K coating is 10-100 microns.
Cure – Cure for 30 minutes at 180°C. This time is the time the material should be cured once it reaches the target temperature. Consideration should be given to oven ramp rates, large heat generating components and other circumstances that may delay the material actually reaching the target temperature.
Shelf life/storage:
When stored in the original unopened containers in a well-ventilated place at 21-27°C, the shelf life is one year from the date of manufacture.
